Void filler

B - Operations – Transporting – 65 – H

Patent

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Details

105/181, 217/5

B65H 81/00 (2006.01) B29D 99/00 (2010.01) B31D 3/02 (2006.01) B32B 3/12 (2006.01) B61D 45/00 (2006.01)

Patent

CA 1245188

ABSTRACT OF THE DISCLOSURE An expansible honeycomb-type void filler formed of stacked strips secured together at spaced and staggered positions to define cell walls which vary in length to provide vertically aligned shortened stretch-limiting walls which reduce hourglass-type distortion, has suspension means consisting of a supporting top strip of the stack and a suspension structure element, said suspension means also including parts movable in a direction lengthwise of the strips to provide openable cells between the suspension structural element and the supporting top strip of the stack. The void filler is also disclosed as having widened adhesive connections in an upper region, and as being formed of corrugated paperboard which is partially crushed.

462574

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