Wafer aligner

Details Wafer aligner Wafer aligner

H - Electricity

01

L

356/194

H01L 21/68 (2006.01) H01L 21/677 (2006.01)

Patent

CA 1182586

WAFER ALIGNER ABSTRACT An apparatus for prealigning a silicon wafer prior to transfer to a work station. The wafer is spun on an aligning platform by means of air jets eminating from holes disposed in the surface of the platform while simultaneously being stopped by means of a vacuum source communicating with the surface of the platform. Sensor means detect when the wafer is centered within a first predetermined tolerance to turn off the air jets and vacuum to stop the wafer. Control means responsive to the sensor means then center the wafer to within a second predetermined tolerance. The wafer is then transported to the work station for processing.

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