Wafer and method

G - Physics – 01 – F

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

G01F 1/66 (2006.01) F16L 55/00 (2006.01) G01F 15/18 (2006.01) G10K 11/00 (2006.01)

Patent

CA 2420838

A wafer for placement in a pipe. The wafer includes a housing having an outer surface and an orifice adapted to allow fluid flowing in the pipe to pass through the housing. The housing has at least a first port extending into the housing from the outer surface for holding a first acoustic transducer. The wafer includes means for attaching the housing to the pipe. A method for obtaining information about fluid in a pipe.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Wafer and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer and method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1747038

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.