Wafer bonding techniques to minimize built-in stress of...

Details Wafer bonding techniques to minimize built-in stress of... Wafer bonding techniques to minimize built-in stress of...

H - Electricity

01

L

H01L 21/20 (2006.01) H01L 21/762 (2006.01)

Patent

CA 2397760

A bonded wafer fabrication mechanism for a micro-mirror structure provides for oxidizing a device wafer instead of a handle wafer or splitting thermal oxidation processing between the device wafer and the handle wafer prior to etching. The flatness of mirrors in micro-mirror structures fabricated according to such a mechanism is substantially improved.

L'invention concerne un procédé de fabrication d'une tranche liée pour une structure micromiroir destinée à réduire par l'oxyde une tranche de dispositif au lieu d'une tranche de manipulation ou à séparer le traitement d'oxydation thermique entre la tranche de dispositif et la tranche de manipulation avant la gravure. La planéité des miroirs dans les structures micromiroirs fabriquées selon ce procédé est sensiblement améliorée.

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