Wafer carrier

Details Wafer carrier Wafer carrier

H - Electricity

01

L

217/142

H01L 21/00 (2006.01) H01L 21/673 (2006.01)

Patent

CA 1322999

ABSTRACT OF THE INVENTION A moldable plastic, distortion and warp resistent wafer carrier having an open top for insertion and removal of wafers with opposed upright end walls. Side walls with inner opposed ribs for spacing axially aligned wafers in the carrier are provided wherein one upright end wall is H-shaped with a horizontal indexing bar extending thereacross intermediate the height of the carrier while the other upright end wall is comprised of a center panel and two side panels each oriented at an oblique angle relative to the center panel. The center panel has a planar outer surface with an upright center line and two planar inner surfaces being oriented obliquely to each other at the center line so that the center panel is thinner adjacent the center line than at outer edge portions of the center panel. A transverse outwardly extending upper flange is on each side wall. Each flange has at least two anti-warp indentations adjacent its respective ends to permit the mold to hold the wafer carrier in its originally molded shape as a wafer carrier cools in the mold thereby minimizing the warp of the wafer carrier within the mold.

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