Wafer carrier and semiconductor apparatus for processing a...

F - Mech Eng,Light,Heat,Weapons – 26 – B

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F26B 21/06 (2006.01) B65G 1/00 (2006.01) B65G 25/00 (2006.01) B65G 49/07 (2006.01) B66C 17/08 (2006.01) C23C 16/00 (2006.01) C23C 16/458 (2006.01) C23C 16/54 (2006.01) F26B 13/30 (2006.01) F26B 17/24 (2006.01) F26B 17/30 (2006.01) F26B 19/00 (2006.01) F26B 25/06 (2006.01) H01L 21/673 (2006.01)

Patent

CA 2319636

A wafer carrier (34) is provided comprised of a circular plate having a flat edge region (31) extending around the circumference of the plate. The plate has a circular recessed center region with a recessed bottom surface and includes an upwardly inclined surface (33) around the periphery of the recessed bottom surface. A substrate (35) is placed in the center region where it is supported by a portion of the upwardly inclined surface and is spaced apart from the recessed bottom surface such that the substrate is supported only around its edge. The wafer carrier minimizes surface contact with the substrate thereby minimizing metal contamination and surface damage to the backside of a substrate and prevents deposition on the baskside of the substrate.

L'invention concerne un support (34) de tranche composé d'un plateau circulaire présentant une région (31) extérieure plate s'étendant sur le pourtour du plateau. Le plateau présente une région centrale circulaire en retrait comprenant une surface de fond en retrait, et une surface (33) inclinée vers le haut, disposée sur la périphérie de la surface de fond en retrait. Un substrat (35) est placé dans la région centrale où il est supporté par une partie de la surface inclinée vers le haut et est séparé de la surface de fond en retrait de manière à être supporté uniquement sur sa périphérie. Ce support de tranche permet de diminuer la surface de contact avec le substrat ce qui réduit la contamination métallique et les dégâts superficiels sur la face arrière du substrat, et empêche les dépôts sur la face arrière du substrat.

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