H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 27/14 (2006.01) G01R 31/28 (2006.01) H01L 21/66 (2006.01)
Patent
CA 2229713
A wafer (10) is described comprising several integrated optoelectronic circuits of a first type (11), such circuits of the first type each comprising electronic modules (13) and at least a first photodiode (14). Said wafer (10) is characterised in that it further comprises at least one integrated optoelectronic circuit of a second type (21) comprising electronic modules (23), at least one second photodiode (24) and at least one bonding pad (25) intended to be connected to an external measuring apparatus, said at least one bonding pad (25) being superposed onto said at least one second photodiode (24) so that said at least one circuit (21) of the second type may be used as a circuit for verifying the manufacturing of said wafer.
Plaquette (10) comprenant plusieurs circuits optoélectroniques intégrés d'un premier type (11), composés chacun de modules électroniques (13) et d'au moins une première photodiode (14). La plaquette (10) se caractérise par le fait qu'elle comprend en outre au moins un circuit optoélectronique intégré d'un deuxième type (21) comprenant des modules électroniques (23), au moins une deuxième photodiode (24) et au moins un plot de connexion (25) destiné à être connecté à un dispositif de mesure externe, le ou les plots de connexion (25), selon le cas, étant superposés à la ou aux deuxièmes photodiodes (24) de sorte que le ou les circuits (21) du deuxième type puissent être utilisés pour vérifier la fabrication de la plaquette.
Grandjean Andre
Kunz Pascal
Em Microelectronic-Marin Sa
Gowling Lafleur Henderson Llp
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