Wafer holder for semiconductor manufacturing apparatus

Details Wafer holder for semiconductor manufacturing apparatus Wafer holder for semiconductor manufacturing apparatus

H - Electricity

01

L

H01L 21/68 (2006.01) H01L 21/00 (2006.01) H01L 21/687 (2006.01)

Patent

CA 2326093

A wafer holder includes a heater and at least one pair of ceramic base members with the heater interposing therebetween. A backside structure located on the backside relative to heater has a heat insulating structure. The ceramic base member in the backside structure is formed of ceramic having a lower heat conductivity than that of the ceramic base member in a holding surface side structure. Further, the ceramic base member in the backside structure has a heat conductivity of 100 W/mK or less and a joint layer has a heat conductivity of 10 W/mK or less. In this way, the wafer holder can be provided capable of preventing heat from spreading toward the backside of the wafer holder.

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