Wafer level integration of multiple optical elements

Details Wafer level integration of multiple optical elements Wafer level integration of multiple optical elements

H - Electricity

01

L

H01L 27/00 (2006.01) H01L 25/16 (2006.01) H01S 5/00 (2006.01)

Patent

CA 2304670

Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. A seal for each die preventing the dicing slurry from getting between the wafers is desirable. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Selon l'invention, on peut former plusieurs éléments optiques intégrés en fixant ensemble des substrats contenant de tels éléments optiques, ou en dotant l'un ou l'autre côté du substrat d'une plaquette de tels éléments. Puis on découpe ensuite en puces la plaquette, afin d'obtenir les unités individuelles elles-mêmes. Il est souhaitable d'utiliser un joint pour à chaque puce, afin d'empêcher la boue de découpage des puces de s'introduire entre les plaquettes. On peut former les éléments optiques de manière lithographique, directement, ou en utilisant un gabarit produit de manière lithographique pour incruster les éléments. Des caractéristiques d'alignement facilitent la production efficace de tels éléments optiques intégrés, de même que le traitement de création postérieure de ceux-ci au niveau de la plaquette.

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