Wafer level integration of multiple optical elements

Details Wafer level integration of multiple optical elements Wafer level integration of multiple optical elements

H - Electricity

01

L

H01L 21/77 (2006.01) H01L 21/78 (2006.01)

Patent

CA 2492335

Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. A seal for each die preventing the dicing slurry from getting between the wafers is desirable. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignments features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

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