Wafer-like processing after sawing dmds

Details Wafer-like processing after sawing dmds Wafer-like processing after sawing dmds

H - Electricity

01

L

H01L 21/78 (2006.01) G02B 26/08 (2006.01)

Patent

CA 2115947

ABSTRACT A method of fabricating debris intolerant devices 30, and especially micro-mechanical devices such as DMDs, that allows wafers to be sawn prior to completing all fabrication steps. Some devices are too fragile to allow cleaning operations to be performed after fabrication of the device. A solution is to saw and clean the wafers prior to completing the fabrication steps that make the device fragile. To prevent having to process the chips 30 individually, a substrate wafer 28 is attached to the backside of the dicing tape 24. This substrate wafer holds the sawn chips 30 in alignment allowing the remaining fabrication steps to be performed in wafer form. TI-17394 Page - 10

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