Wafer-like processing after sawing dmds

Details Wafer-like processing after sawing dmds Wafer-like processing after sawing dmds

H - Electricity

01

L

H01L 21/78 (2006.01) B25B 11/00 (2006.01) B28D 5/00 (2006.01) B28D 5/02 (2006.01) B81C 1/00 (2006.01) G02B 26/08 (2006.01) H01L 21/68 (2006.01)

Patent

CA 2126111

ABSTRACT A processing fixture and method of fabricating micromechanical devices, such as digital micromirror devices, that allows fragile structures on wafer 22 to be protected from debris during the saw operation and subsequent cleaning operations. The wafer 22 is attached to a vacuum fixture 26 after partially sawing the water 22 to create saw kerfs. The backside of the wafer 22 is then ground down to the saw kerfs 24 to separate the devices 32. Each device 32 is held on the fixture by a vacuum in the headspace above the device 32. In an alternate embodiment the devices are separated by sawing completely through the wafer while in the fixture.

Affiliated with

Also associated with

Rating

Wafer-like processing after sawing dmds does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer-like processing after sawing dmds, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer-like processing after sawing dmds will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1601790