Wafer orienting apparatus

Details Wafer orienting apparatus Wafer orienting apparatus

H - Electricity

05

K

356/194

H05K 3/00 (2006.01) H01L 21/677 (2006.01)

Patent

CA 1142276

Abstract An apparatus and method for orienting a substantially flat wafer are described. The wafer pre- ferably has two flat registration edges of unequal length. Upon contact of any edge portion of the wafer with a sense means projecting forwardly from one registration surface, air jets are activated to rapidly rotate the wafer one way until the longer of its two registration edges contacts a sense means projecting forwardly from another registration surface. Then air jets are activated to slowly rotate the wafer the opposite way until said longer registration edge contacts another sense means associated with said other registration surface to effect precise registra- tion of the wafer without overshoot as all three sense means are concurrently contacted and activated. Wafer movement by the jets thereupon terminates and vacuum is applied continuously to hold the wafer in place while the work operation is performed thereon. Since the wafer is registered solely by contact with the various sense means (and not by contact with the respective registration surfaces), contamination of the wafer by physical contact is minimized. SA9-78-082

352819

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