Wafer packaging system

Details Wafer packaging system Wafer packaging system

B - Operations, Transporting

65

D

217/142, 217/24

B65D 85/30 (2006.01) B65D 25/10 (2006.01) H01L 21/673 (2006.01)

Patent

CA 1107692

ABSTRACT OF THE DISCLOSURE The invention relates to a fragile wafer packaging system inclusive of an inner tubular container which is adapted to be contained by an outer tubular container with the containers in combination sharing a common longitudinal axis. The inner container provides means for supporting a plurality of wafers through the utilization of resilient projections extending toward the interior of the inner container from the interior surface of the inner container top and bottom portions, these resilient projection means contacting the periphery of each individual wafer and supporting said wafers in a spring loaded fashion completely free of container wall contact.

270432

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