Wafer packaging system

Details Wafer packaging system Wafer packaging system

B - Operations, Transporting

65

D

217/142, 217/2,

B65D 85/30 (2006.01) B65D 25/10 (2006.01) H01L 21/673 (2006.01)

Patent

CA 1107691

19-21-0249 WAFER PACKAGING SYSTEM ABSTRACT OF THE DISCLOSURE A wafer packaging system for clean packaging and damage-free transporting of semiconductor wafers. The system includes tubular outer and inner containers, the inner con- tainer adapted to be contained by the outer container with the longitudinal axes of both containers extending in the same axial direction. The inner container includes provision for holding a plurality of the semiconductor wafers in spaced face-to-face relationship. The system provides a sealed con- tainer arrangment preventing contaminants outside the outer container from contaminating wafers within the inner container. Shock-absorbing features associated with the containers pre- vent shocks applied to the outer container from damaging the wafers.

270431

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