H - Electricity
01
L
356/117
H01L 21/66 (2006.01) G01R 1/073 (2006.01)
Patent
CA 1271848
Abstract A wafer probe for testing semiconductor devices brings low impedance connections closely adjacent device bonding pads for bypassing power supply voltages.
551319
Cascade Microtech Inc.
Kirby Eades Gale Baker
LandOfFree
Wafer probe does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer probe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer probe will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1180703