Wafer processing apparatus and method, wafer convey robot,...

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H01L 21/68 (2006.01) H01L 21/00 (2006.01) H01L 21/20 (2006.01) H01L 21/306 (2006.01) H01L 21/311 (2006.01)

Patent

CA 2228552

A holder driving mechanism holds a wafer holder with gripping portions, and swings it within a wafer processing bath. When the peripheral portion of a wafer comes into contact with the distal end portion of a swing support member, the wafer rotates and vertically moves in the wafer holder. The wafer can be efficiently swung, and processing can be made uniform. By supplying ultrasonic waves from an ultrasonic bath, the processing rate can be increased.

L'invention porte sur un mécanisme d'entraînement qui tient un dispositif de retenue des plaquettes au moyen d'éléments de préhension et qui fait pivoter ce dernier jusque dans un bain pour le traitement des plaquettes. Lorsque la partie périphérique d'une plaquette entre en contact avec l'extrémité distale d'un élément de support pivotant, la plaquette tourne et se déplace à la verticale dans le dispositif de retenue des plaquettes. Il est donc possible de faire pivoter la plaquette efficacement et de rendre le traitement uniforme. En outre, il est possible d'augmenter la vitesse de traitement en émettant des ondes ultrasoniques à partir d'un bain à ultrasons.

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