Wafer processing apparatus, wafer processing method, and...

Details Wafer processing apparatus, wafer processing method, and... Wafer processing apparatus, wafer processing method, and...

H - Electricity

01

L

H01L 21/02 (2006.01) B08B 3/10 (2006.01) B08B 3/12 (2006.01) H01L 21/00 (2006.01) H01L 21/20 (2006.01) H01L 21/306 (2006.01)

Patent

CA 2229975

An ultrasonic bath (30) is arranged below a wafer processing bath (10). Wafers (40) are processed while ultrasonic waves are transmitted from the ultrasonic bath (30) to the wafer processing bath (10). The wafers (40) are processed while being entirely dipped into the wafer processing bath (10) and rotated by wafer rotating rods (53).

L'invention concerne un appareillage constitué d'un bain aux ultrasons (30) disposé sous un bain de traitement (10) de plaquettes. Les plaquettes (40) sont traitées alors que des ondes ultrasonores sont transmises du bain aux ultrasons (30) au bain de traitement (10) des plaquettes. Pendant le traitement, les plaquettes (40) sont immergées dans le bain de traitement (10) et subissent une rotation que leur impriment des tiges de rotation (53).

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