H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/68 (2006.01) H01L 21/00 (2006.01) H01L 21/20 (2006.01) H01L 21/306 (2006.01) H01L 21/311 (2006.01)
Patent
CA 2228571
A wafer is supported while being rotated by four wafer rotating rods having grooves. The wafer rotating rods are rotated by a driving force transmitted from a motor installed outside a wafer processing bath. An ultrasonic bath is arranged below the wafer processing bath, and ultrasonic waves generated by an ultrasonic source are transmitted to the wafer processing bath. The ultrasonic waves are efficiently transmitted to the wafer because the wafer is supported only by the wafer rotating rods.
L'invention concerne une plaquette qui est soutenue pendant sa rotation par quatre tiges de rotation de plaquettes comportant des rainures. Une force d'entraînement, transmise par un moteur monté à l'extérieur d'un bain pour le traitement des plaquettes, fait tourner les tiges de rotation susmentionnées. Un bain à ultrasons est disposé sous le bain pour le traitement des plaquettes afin de transmettre des ondes ultrasoniques générées par une source ultrasonique. Ces ondes sont transmises à la plaquette de façon efficace, car cette dernière n'est soutenue que par les tiges de rotation.
Canon Kabushiki Kaisha
Ridout & Maybee Llp
LandOfFree
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