Wafer release method and apparatus

Details Wafer release method and apparatus Wafer release method and apparatus

H - Electricity

01

L

H01L 21/822 (2006.01) H01L 21/68 (2006.01) H01L 21/683 (2006.01)

Patent

CA 2118619

A wafer position and clamp sensor. A circuit (114) monitors capacitance between two electrodes (22,24) within a wafer support. With no wafer on the support, the capacitance falls in one range, with the waferin place but not clamped, the capacitance falls in a second range and with the wafer held in place by an electrostatic attraction the capacitance falls in a third range. The sensed capacitance is converted to a frequency and then a D.C. voltage level that can easily be sensed and used to confirm wafer placement and then wafer clamping. After the wafer has been treated, the wafer is removed and the next subsequent wafer treated, A clamping voltage applied to clamp the wafer to its support is reversed at a controlled frequency to release the wafer. The voltage reversal disrupts the electrostatic attraction between the wafer and its support.

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