Wafer shape and method of making same

Details Wafer shape and method of making same Wafer shape and method of making same

H - Electricity

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356/132

H01L 27/00 (2006.01) H01L 21/306 (2006.01) H01L 29/06 (2006.01)

Patent

CA 1213076

Improved Wafer Shape and Method of Making Same Abstract A semiconductor wafer shape which when subjected to a simultaneous polishing of both wafer surfaces produces a wafer of superior flatness and surface finish, the said wafer having a diametral cross-sectional shape like that of a "dogbone" wherein the wafer is thinner in its medial region than it is in the peripheral region and has rounded edges, this shape resulting from a chemical thinning operation.

484098

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