Wafer slicing apparatus

Details Wafer slicing apparatus Wafer slicing apparatus

B - Operations, Transporting

27

C

144/87

B27C 5/00 (2006.01) B27L 11/02 (2006.01)

Patent

CA 1148451

WAFER SLICING APPARATUS ABSTRACT OF THE DISCLOSURE A rotatable carrier has a plurality of cutter knives protruding from a work face thereof. A feed passage is positioned to direct longitudinal sides of wood pieces against the carrier face to enable the knives to slice wafers from the pieces during rotation of the carrier. The feed passage is defined by opposed side walls each having a plurality of superimposed gripper chains with runs forming a moving inner surface of the respective wall. These chains are adapted to grip the ends of wood pieces and move said pieces along the passage. The chain arrangement of at least one side wall is mounted in floating relationship to that of the other side wall and is resiliently biased towards the latter.

380631

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