Wafer suspension box

B - Operations – Transporting – 65 – D

Patent

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Details

B65D 85/57 (2006.01) H01L 21/673 (2006.01)

Patent

CA 2075654

A ridged, transparent, thermoplastic package for transporting substrate wafers is disclosed. The package includes elastomeric cushions which hold the substrate wafers in a manner which precludes them from becoming damaged during normal shipping and handling.

L'invention divulguée est un emballage thermoplastique transparent côtelé servant à transporter des plaquettes de substrat. L'emballage contient des coussinets élastomériques qui retiennent les plaquettes de substrat et empêchent celles-ci d'être endommagées au cours d'opérations d'expédition et de manipulation normales.

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