H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/194
H01L 27/02 (2006.01) G03F 9/00 (2006.01) H01L 21/70 (2006.01)
Patent
CA 1166363
Abstract: The present invention relates to a method and apparatus for aligning a semiconductor wafer of the type that includes, on a surface portion of the wafer, image forming units that, when illuminated by incident radiation, forms at least a first focused image located a first prescribed distance from the surface and a second focused image located a second prescribed distance from the surface. A directing unit is provided for directing incident radiation onto the image forming units to form the first and second focused images. A position sensor is also provided. A projector is provided for projecting the first focused image into the position sensor to form a first projected image. A moving unit is provided which is responsive to the position sensor for moving the wafer. The apparatus is characterized in that a projector is provided for projecting the second focused image onto the position sensor to form a second projected image. The position sensor is adapted to indicate the positions of the first and second projected images. The moving unit is adapted to move the wafer so that the first and second projected images are displaced from preselected positions by amounts which are proportional to the first and second prescribed distances respectively.
398956
Feldman Martin
White Alan D.
White Donald L.
Kirby Eades Gale Baker
Western Electric Company Incorporated
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