Wafer transfer device

Details Wafer transfer device Wafer transfer device

H - Electricity

01

L

356/188, 269/8

H01L 21/66 (2006.01) B25J 7/00 (2006.01) G01R 1/067 (2006.01) H01L 21/677 (2006.01) H01L 21/68 (2006.01) H01L 21/683 (2006.01) H01L 21/687 (2006.01)

Patent

CA 1044379

ABSTRACT OF THE DISCLOSURE A device to facilitate electrical measurement, including step-and-repeat measurement of minute circuits on a semicon- ductor wafer by placing the wafer in a specific, angular and cartesian coordinate position with respect to a certain orien- tation of a disc-like pallet of somewhat larger diameter than the wafer. The apparatus includes a stack of available pallets, each having an indexing portion, arms to engage the pallet in turn and to interfit with the indexing portion, a translational motion device to move the arms and pallet to another specific location to receive the wafer, a controllable section device to hold the wafer and to rotate it about a vertical axis, and a further controlled guide device to move the arms and wafer in specific X and Y directions to a predetermined orientation. The device includes a connection between each pallet and an evacuating apparatus to affix the wafer to the pallet by suction when the wafer is released from the suction device on the orient- ing structure. The apparatus further includes a receiving struc- ture to receive pallets with wafers affixed thereto. In ad- dition, the pallets and wafers are subsequently moved from a stack of untested wafers to testing apparatus that includes probes arranged to engage specific minute areas on the wafers. One of the probes including electrical contact means to be energized by engagement with the surface of the wafer and to control ad- ditional movement of the probes toward the surface to a specific amount to exert a predetermined pressure by the probes on the wafer. After testing, the pallets with tested wafers are moved to a location set aside therefore.

242588

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