B - Operations – Transporting – 27 – M
Patent
B - Operations, Transporting
27
M
144/48, 20/38.1
B27M 3/00 (2006.01) B27B 1/00 (2006.01) B27N 3/04 (2006.01) B27N 3/14 (2006.01) B32B 21/02 (2006.01)
Patent
CA 1281528
WAFERBOARD LUMBER ABSTRACT OF DISCLOSURE Substitute lumber pieces having strengths and densities substantially equivalent to lumber are cut from single layer panels of over about 1 and normally less than 4 inch thickness made from wood wafers. The wafers are oriented with their lengths having a mean deviation to the longitudinal length of the panel measured in the major plane of the panel in the range of 0 to 10 degrees and a mean deviation measured in a minimum longitudinal plane perpendicular to the major plane from 0 to about 5 degrees and have an average effective length of at least 8 inches (200 mm), and preferably an average thickness less than 0.15 inches (4 mm) and a width of at least 0.25 inches (6 mm). Lumber is made by cutting the panel longitudinally. Preferably the panels are formed to have a substantially uniform density profile throughout their thicknesses.
517415
Rowley C.a.
Trus Joist Macmillan A. Limited Partnership
LandOfFree
Waferboard lumber does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Waferboard lumber, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Waferboard lumber will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1185329