Waferboard process

Details Waferboard process Waferboard process

B - Operations, Transporting

32

B

154/96, 154/97

B32B 21/02 (2006.01) B27N 3/00 (2006.01)

Patent

CA 1135610

ABSTRACT OF THE DISCLOSURE A process for the preparation of a wood chip board wherein a particulate wood chip furnish is coated with a binding agent, dried and thereafter formed into a board which process comprises the steps of: (a) providing a wood chip furnish derived from either green wood, or wood taken from a log pond; (b) coating the particles of the wood chip furnish over a substantial portion of their surface area with a binder by dip coating the wood chip furnish with a solution, suspension or dispersion of a binding agent in a solvent, whereby less than 15% by weight of binder, based on the dry weight of the wood chip furnish, is coated onto the furnish; (c) adjusting the water and other volatile solvent content of the coated particulate furnish to not more than 15% by weight; and (e) forming the thus treated furnish into a wood chip board under the influence of heat and pressure. This process is capable of providing a wood chip board having the same strength, etc., properties as a plywood, and is thus useful in construction application.

307775

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