Wafering device and method of using same

Details Wafering device and method of using same Wafering device and method of using same

B - Operations, Transporting

28

D

164/23, 164/44

B28D 1/06 (2006.01)

Patent

CA 1310898

ABSTRACT An apparatus and method for wafering an ingot of semiconductor material. Wafering blades are fabricated from one or more layers of a fiber reinforced plastic tape and coated with an abrasive material which is embedded into the exposed flat surfaces of the blades. An assembly of such blades is used in a wafering device in which the blades are reciprocated while the ingot is plunged against the cutting edges of the blades. The primary cutting action occurs as exposed ends of the fiber material at the blade edges contact the ingot. The abrasive material on the blade sides provides additional side cutting action and produces a polished finish on the surfaces of the resulting wafers.

579696

Affiliated with

Also associated with

Rating

Wafering device and method of using same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafering device and method of using same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafering device and method of using same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1296218