Waferized power connector

Details Waferized power connector Waferized power connector

H - Electricity

01

R

H01R 12/16 (2006.01) H01R 13/514 (2006.01) H01R 13/24 (2006.01)

Patent

CA 2436064

An interconnect system for printed circuit boards. The interconnect system includes signal wafers that carry high speed signals between printed circuit boards. The interconnect system also includes power modules assembled from wafers. The power modules are compact, easy to manufacture and easily integrate with the signal contact wafers to provide a single connector.

La présente invention concerne un système d'interconnexion destiné à des cartes à circuits imprimés. Le système d'interconnexion comprend des tranches à signal qui véhiculent des signaux à grande vitesse entre les cartes à circuits imprimés. Le système d'interconnexion comprend également des modules de puissance assemblés qui proviennent des tranches. Les modules de puissance sont compacts, faciles à fabriquer et s'intègrent facilement dans les tranches de contact des signaux pour former un connecteur unique.

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