Wallboard bundling tape and method

B - Operations – Transporting – 65 – D

Patent

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Details

B65D 69/00 (2006.01) B65B 17/02 (2006.01)

Patent

CA 2053621

ABSTRACT OF THE DISCLOSURE A bundling tape has two rows of perforations extending from one end of the tape to the other; the perforations are arranged inward of and substantially parallel to the edges. A first band is formed between one edge and a first row of perforations, and a second band is formed between the other edge and the second row of perforations; between the two rows of perforations is a center band tear strip. The bands have co-planar upper and lower surfaces. Adhesive is applied only to the bottom surfaces of the first and second band; there is no adhesive on the center band. Bundles of material, such as wallboard, are fastened together by adhering the bottom surface of the first band to the uppermost sheet of material, and by adhering the bottom portion of the second band to the lowermost sheet.

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