Wallboard taping process, apparatus and composition therefor

C - Chemistry – Metallurgy – 04 – B

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C04B 24/26 (2006.01) E04F 21/165 (2006.01)

Patent

CA 2041860

Abstract of The Disclosure An apparatus, process and composition for taping joints between pieces of wallboard. The apparatus includes a taping head, slidingly contactable with a wall, for substantially simultaneously applying a first layer of a joint compound to a joint between pieces of wallboard, embedding a wallboard tape in the first layer of the joint compound, and overcoating the embedded wallboard tape with at least one additional layer of the joint compound; a handle, connected to the taping head, for supporting the taping head, the handle being manually graspable by an operator, the handle having a fluid couduit formed therein for passing joint compound to the taping head; a tape supply mounted on the handle for supplying wallboard tape to the taping head; a backpack, wearable by the operator, for supporting a supply of the joint compound and for producing a pressurized stream of the joint compound; and a flexible connecting means for fluidically interconnecting the backpack and the fluid conduit to pass the pressurized stream of the joint compound from the backpack to the fluid conduit. The method includes the substantially simultaneous steps of applying a first layer of a joint compound to a joint between pieces of wallboard; embedding a wallboard tape in said first layer of the joint compound; and overcoating the embedded wallboard tape with at least one additional layer of the joint compound. The composition includes 35-60% by weight of a gypsum base plaster; from about 30-70% by weight of an alcohol-water mixture; 10-25% by weight of polyvinyl acetate; and optionally from about 0-5% by weight of polyvinyl alcohol. The alcohol-water mixture comprises from about 0-30% by weight of water. 4280b/10

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Wallboard taping process, apparatus and composition therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wallboard taping process, apparatus and composition therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wallboard taping process, apparatus and composition therefor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1564336

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.