C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
C09D 157/10 (2006.01) C08F 220/28 (2006.01) C08F 246/00 (2006.01) C09D 133/06 (2006.01)
Patent
CA 2061418
ABSTRACT OF THE DISCLOSURE The invention relates to formation of a resin film excellent in adhesion with metal or other material and also excellent in alkaline resistance. The invention presents a water-based resin dispersion having an acid value of 0 to 15 obtained by emulsion polymerization of a monomer mixture comprising, in 100 parts by weight of .alpha.,.beta.-ethylenically unsaturated monomer, (1) 1 to 20 parts by weight of .alpha.,.beta.- ethylenically unsaturated monomer with a .beta.-ketoester group, (2) 0.05 to 5 parts by weight of crosslinking .alpha.,.beta.- ethylenically unsaturated monomer with two or more radically polymerizable groups, and (3) the rest of other .alpha.,.beta.- ethylenically unsaturated monomer than (1) and (2), by using a radically polymerizable emulsifier at a ratio of 0.2 to 10 parts by weight against the total of 100 pats by weight of the .alpha.,.beta.-ethylenically unsaturated monomer.
Nishimoto Kazuhiko
Saito Koichi
Tokuyama Akio
Usuki Kazuhiko
Yoshioka Manabu
Bereskin & Parr
Nippon Paint Co. Ltd.
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