C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/5514, 400/74
C08L 75/04 (2006.01) B32B 7/12 (2006.01) C08G 18/08 (2006.01) C08G 18/10 (2006.01) C09J 175/04 (2006.01)
Patent
CA 1324856
ABSTRACT This invention presents new water-based adhesives suitable for use in thermoforming lamination systems. More particularly, this invention presents water-based adhesive- forming compositions comprising an aromatic polyurethane in water dispersion or emulsion and a compatible cross-linking agent; also includable in the compositions are thickening ag- ents and pigments. These new adhesives, it has been found, exhibit bonding strengths and temperature resistance far superior to the solvent and water-based adhesives currently used in industrial applications, and are useful in thermo- forming lamination processes. Also disclosed is a one-step thermoform lamination edge-folding process using the adhe- sive.
566008
Osler Hoskin & Harcourt Llp
Uniroyal Plastics Company Inc.
LandOfFree
Water-based thermoforming adhesive does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Water-based thermoforming adhesive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Water-based thermoforming adhesive will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1200832