C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
C08K 5/56 (2006.01) C08K 5/00 (2006.01) C08L 101/00 (2006.01) C08L 101/10 (2006.01) C09D 5/34 (2006.01)
Patent
CA 2112282
Abstract of the Disclosure The present invention provides a water- curable resin composition for use in the preparation of composite materials. The resin composition is composed of a water-reactive liquid organometallic compound having a viscosity of no greater than about 500,000 centipoise under ambient conditions; and a nonreactive organic thermoplastic polymer, having a number average molecular weight of at least about 1,000, mixed with the water-reactive liquid organometallic compound. Preferably, the water- reactive liquid organometallic compound is a compound of the formula Image wherein: each R1 is independently a substituted or unsubstituted C1-C100 hydrocarbon group, optionally interrupted in the backbone by 1-10 nonperoxide -O-, -S-, -C(O)-, or -N- groups; each R2 is independently selected from the group consisting of hydrogen and a substituted or unsubstituted C1-C100 hydrocarbon group, optionally interrupted in the backbone by 1-10 nonperoxide -O-, - S-, -C(O)-, or -N- groups; x is an integer between 1 and y, inclusive; y is the valence of M; and M is boron, aluminum, silicon, or titanium.
Ersfeld Dean A.
Moren Dean M.
Minnesota Mining And Manufacturing Company
Smart & Biggar
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