Water-developable photosensitive resin composition, and...

G - Physics – 03 – F

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G03F 7/033 (2006.01)

Patent

CA 1332212

- 1- Abstract: The present invention discloses a water-developable photosensitive resin composition capable of hot melt molding, which comprises: (i) a water soluble or water dispersible polyvinyl alcohol prepared by saponifying a copolymer of a vinyl ester and another copolymerizable monomer, which has a saponification degree of the vinyl ester unit of 50 to 70 mol % and a hot melt flow starting temperature of 60 to 130°C, (ii) a polymerizable monomer and (iii) a photopolymerization initiator.

556495

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