Water reducible phenolic modified alkyd resin

Details Water reducible phenolic modified alkyd resin Water reducible phenolic modified alkyd resin

C - Chemistry, Metallurgy

08

L

402/48, 400/7313

C08L 67/08 (2006.01) C08G 63/48 (2006.01) C08G 63/91 (2006.01) C09D 167/08 (2006.01)

Patent

CA 1278137

ABSTRACT OF THE DISCLOSURE Water reducible phenolic modified resins are described for use as binders in coating compositions which are non-lifting, recoatable with improved metal adhesion and corrision resistance.

516054

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