Water sensitive hot melt adhesive composition

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 129/10 (2006.01) A61L 15/24 (2006.01) A61L 15/34 (2006.01) A61L 15/58 (2006.01) C08K 5/00 (2006.01) C09J 193/00 (2006.01) C09J 193/04 (2006.01) C08L 93/04 (2006.01)

Patent

CA 2167577

A water sensitive hot melt adhesive composition is described which possesses properties which are desirable with respect to the construction of disposable articles. The adhesive composition includes about 5 % to about 95 % by weight of a poly [vinyl methyl ether]; about 5 % to about 70 % by weight of a tackifying resin; and about 5 % to about 35 % by weight of a water soluble plasticizer.

On décrit une composition fusible thermoadhésive sensible à l'eau possédant des propriétés très utiles pour la réalisation d'articles à usage unique. La composition adhésive contient entre environ 5 % et environ 95 % en poids de poly[vinylméthyléther]; entre environ 5 % et environ 70 % en poids d'une résine adhésive; et entre environ 5 % et environ 35 % en poids d'un plastifiant hydrosoluble.

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