C - Chemistry – Metallurgy – 04 – B
Patent
C - Chemistry, Metallurgy
04
B
23/133, 154/143,
C04B 41/50 (2006.01) B32B 7/12 (2006.01) C04B 12/00 (2006.01) C04B 28/00 (2006.01) C09D 1/00 (2006.01) C09J 1/00 (2006.01)
Patent
CA 1333745
Water-soluble film-forming inorganic compounds having a specific gravity of 1.1 or more and capable of being formed into a film at ambient temperature or by heating. The compounds are formed by a reaction of a metal, a hydroxide of an alkali metal, and hydrofluoric acid or boric acid and their salts or their submineral acid salts. The water- soluble film-forming inorganic compounds which are superior in refractory, heat-resistance and heat-insulating properties, also have rust-inhibitory properties. The compounds are useful as heat-resistant adhesives in fireproof and heat-resistant layered composites made of metal, wood, and the like. A process of coating materials with a layer of these compounds is also provided.
602501
Kokuta Hiroshi
Kokuta Katsuhiro
Kokuta Kenji
Kokuta Naoto
Kohmix Co. Ltd.
Marks & Clerk
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