C - Chemistry – Metallurgy – 08 – J
Patent
C - Chemistry, Metallurgy
08
J
C08J 9/08 (2006.01) B05D 1/32 (2006.01) B23K 35/22 (2006.01) C09D 4/00 (2006.01) G03F 7/027 (2006.01) G03F 7/028 (2006.01) H05K 3/00 (2006.01) H05K 3/30 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2116331
A water-soluble coating or other deposit is produced from a formulation that is comprised of a curable liquid substance and a dispersed, particulate effervescing agent. The formulation is particularly useful as a solder resist in the manufacture of PCBs, and the preferred composition contains n-vinyl-2-pyrrolidone, N,N-dimethylacrylamide, and polyvinylpyrrolidone.
Un revêtement hydrosoluble ou un autre dépôt est produit à l'aide d'une formulation qui est constituée d'une substance liquide durcissable et d'un agent effervescent dispersé sous forme de particules. La formulation est particulièrement utile comme produit de protection pour la soudure dans la fabrication des cartes à circuit imprimé et la composition de choix contient de la n-vinyl-2-pyrrolidone, du N,N-diméthylacrylamide et de la polyvinylpyrrolidone.
Bachmann Andrew G.
Grosclaude Gary V.
Dymax Corporation
Seaby George A.
LandOfFree
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