C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
C08F 8/42 (2006.01) C08G 77/00 (2006.01) C08G 85/00 (2006.01) D06M 15/285 (2006.01) D21H 17/59 (2006.01) D21H 21/10 (2006.01) D21H 21/18 (2006.01)
Patent
CA 2193155
A novel water-soluble high-molecular compound which can be used as an additive for papermaking or the like in place of the usual known water-soluble high-molecular compound having a cationic group, which exhibits excellent effect in reinforcing a paper and increasing retention ratio of filler in the papermaking containing filler, which is a silicon-containing water-soluble high-molecular compound having an amino group or ammonium group, wherein a silicon-containing compound (S) having an epoxy group is bonded to the high-molecular compound, and which is produced by reacting the silicon-containing compound (S) having an epoxy group with a water-soluble high-molecular compound (A) having a primary, secondary or tertiary amino group.
Hamaguchi Toshishige
Makino Shigeto
Yamamoto Satoshi
Yoshida Yoshifumi
Marks & Clerk
Sumitomo Chemical Co. Ltd.
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