Water-soluble soldering paste

Details Water-soluble soldering paste Water-soluble soldering paste

B - Operations, Transporting

23

K

B23K 35/363 (2006.01) B23K 35/22 (2006.01) C09K 3/00 (2006.01)

Patent

CA 2053751

A non-toxic, non-corrosive water-soluble soldering paste comprises at least about 80 wt% of particulate solder and the balance a thixotropic flux base having a viscosity of at least about 200,000 cp. The flux base comprises (a) a botanical oil, (b) an aqueous emulsion of a thickening agent, such as corn starch or an ethoxylated linear alcohol in water, and (c) an organic acid having at least two carboxylic acid groups, such as citric acid. The paste of the invention produces solder joints of high metallic luster and excellent quality. Clean-up of paste residues is accomplished using only water.

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