Water-soluble thermosettable resinous compositions...

Details Water-soluble thermosettable resinous compositions... Water-soluble thermosettable resinous compositions...

C - Chemistry, Metallurgy

08

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400/4203, 9/53,

C08G 12/42 (2006.01) C08G 12/04 (2006.01) C08G 12/16 (2006.01) C08G 12/46 (2006.01) C08G 73/02 (2006.01) C08L 61/20 (2006.01) C08L 61/22 (2006.01) D21H 17/17 (2006.01) D21H 17/50 (2006.01) D21H 17/54 (2006.01)

Patent

CA 1188834

Abstract of the Disclosure Disclosed are novel water-soluble, thermosettable resinous compositions derived by reacting a precondensate of dicyandiamide, formaldehyde, a salt of a water-soluble poly- aminopolyamide and an ammonium salt with epihalohydrin and then condensing the reaction product with additional formalde- hyde. The resinous compositions are cationic and have partic- ular utility in the manufacture of paper sized with cellulose reactive sizing agents such as ketene dimer sizing agents.

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