Wave soldering apparatus and method

Details Wave soldering apparatus and method Wave soldering apparatus and method

B - Operations, Transporting

23

K

113/89

B23K 1/08 (2006.01) B23K 3/06 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1195880

WAVE SOLDERING APPARATUS AND METHOD Abstract An apparatus (10) for wave soldering component leads to a conductor on a surface (1043 of a printed circuit board (90) includes a fountain (12) for forming a standing wave (38) of hot molten solder. A pool of hot oil (86) having a specific gravity lower than the solder floats in a depression in the surface of the solder adjacent to the standing wave. The printed circuit board whose surface is to be soldered is passed through the crest (48) of the molten solder standing wave and then, while the solder adhering to the component leads and conductor still is molten, into contact with the pool of hot oil.

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