Wave soldering in a protective atmosphere enclosure over a...

Details Wave soldering in a protective atmosphere enclosure over a... Wave soldering in a protective atmosphere enclosure over a...

H - Electricity

05

K

H05K 3/34 (2006.01) B23K 1/08 (2006.01) B23K 35/38 (2006.01)

Patent

CA 2061646

A short hood for enclosing and providing a protective atmosphere over not more than the solder pot of a machine for wave soldering printed circuit boards. Other operative areas of the machine are exposed to air. The entrance and exit openings to the hood for the circuit boards are covered by electrically conductive curtains of thin material cut into vertical strips. The process employs a thin layer of no-clean flux and allows up to 5% oxygen content in the protective atmosphere.

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