Wavelet analysis for laser ultrasonic measurement of...

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G01N 29/00 (2006.01) G01K 11/22 (2006.01) G01K 13/04 (2006.01) G01N 29/12 (2006.01) G01N 29/24 (2006.01) G01N 29/50 (2006.01) G01N 29/52 (2006.01) G01R 31/265 (2006.01) H01L 21/66 (2006.01)

Patent

CA 2224189

A laser ultrasonics technique (18) is used to characterize a composite dispersive response signal from a sample under analysis, such as a semiconductor wafer (16). Rather than measuring individual accoustic wave velocities at specific frequencies, an entire dispersive response signal (fig. 8) is analyzed. In a presently preferred embodiment of this invention the entire dispersive response signal is analyzed using a wavelet-based technique (figs. 4a, 4b), such as dispersive wavelet transform analysis technique.

Une technique d'ultrasons laser (18) est utilisée pour caractériser un signal de réponse dispersif composite provenant d'un échantillon à analyser, tel qu'une plaquette à semi-conducteurs (16). Plutôt que mesurer les vitesses des différentes ondes acoustiques à des fréquences spécifiques, on analyse un signal de réponse dispersif entier (fig. 8). Dans le mode de réalisation actuellement préféré, la totalité du signal de réponse dispersif est analysée par une technique à base d'ondelettes (fig. 4a, 4b), telle qu'une technique d'analyse par transformation d'ondelettes dispersives.

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