Wax-free, hot melt adhesive compositions

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/1821

C08L 33/02 (2006.01) C08L 35/00 (2006.01) C08L 93/04 (2006.01) C09J 123/08 (2006.01) C09J 193/04 (2006.01)

Patent

CA 1159189

ABSTRACT Wax-free hot melt adhesive compositions based on a copolymer of an ?-olefin, especially ethylene, with an unsaturated carboxylic acid, especially an ?,.beta.-unsaturated carboxylic acid, or with maleic anhydride and optionally also with another unsaturated carboxylic acid or ester; a tall oil rosin; and a hydrocarbon oil provide good quality bonds. When the level of oil is less than 15%, particularly up to about 13%, there is no oil exudation. The hot melt adhesive compositions of this invention have a good melt viscosity stability when an antioxidant, especially a hindered phenol or organic phosphite, is added. These compositions are useful for heat sealing cartons and for similar applications. Formulations containing tall oil rosins and processing oils approved by the Food and Drug Administration can be readily prepared.

385602

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