Wax isomerate having a reduced pour point

Details Wax isomerate having a reduced pour point Wax isomerate having a reduced pour point

C - Chemistry, Metallurgy

08

L

C08L 91/06 (2006.01) C08L 33/10 (2006.01) C10M 105/42 (2006.01) C10M 107/26 (2006.01) C10M 145/14 (2006.01) C10M 169/04 (2006.01)

Patent

CA 2054096

ABSTRACT OF THE DISCLOSURE A combination of a low and a high molecular weight polyalkylmethacrylate has been found to be effective in reducing the pour point of a wax isomerate to a level that cannot be obtained with conventional pour point depressants. In a preferred embodiment, the wax isomerate is a slack wax isomerate.

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