Web substrate having optimized emboss area

D - Textiles – Paper – 21 – H

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

D21H 27/02 (2006.01)

Patent

CA 2762068

The present disclosure provides for a web substrate having at least one ply having a surface thereof. The surface of the at least one ply defines a surface area of the at least one ply. The surface comprises an emboss pattern disposed thereon. The emboss pattern has a surface area defined by a perimeter circumscribing the emboss pattern. The surface area of the emboss pattern ranges from about 5 percent to about 40 percent of the surface area of the at least one ply.

L'invention concerne un substrat bande présentant au moins un pli possédant une surface. La surface du ou des plis définit une superficie du ou des plis. Sur la surface est disposé un motif d'estampage. Le motif d'estampage présente une superficie définie par un périmètre circonscrivant le motif d'estampage. La superficie du motif d'estampage se situe dans une plage allant d'environ 5 pour cent à environ 40 pour cent de la superficie du ou des plis.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Web substrate having optimized emboss area does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Web substrate having optimized emboss area, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Web substrate having optimized emboss area will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1956530

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.