Wire bond attachment of a integrated circuit package to a...

Details Wire bond attachment of a integrated circuit package to a... Wire bond attachment of a integrated circuit package to a...

H - Electricity

01

L

H01L 23/40 (2006.01) H01L 23/367 (2006.01) H05K 3/32 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2327331

A thermally conductive mounting flange of an IC package is placed directly on a heat sink surface between respective sections of single layer PC board attached to the heat sink, such that electrical leads extending from opposing sides of the package are positioned over corresponding conductive areas formed on the surface of the respective adjacent PC board section. The respective package leads are each connected to the corresponding PC board areas by one or more flexible bond wires. In addition to electrically connecting the package leads to the respective PC board sections, the bond wires collectively secure the package to the heat sink in a manner allowing for relative lateral movement between the respective flange and heat sink surfaces in response to thermal stresses.

Selon l'invention, on place une bride de support thermoconductrice d'un boîtier de circuits imprimés, directement sur une surface d'un dissipateur de chaleur, entre des sections correspondantes d'une plaquette monocouche de circuit imprimé fixée sur le dissipateur de chaleur, de façon que des conducteurs électriques s'étendant à partir de côtés opposés du boîtier soient placés au-dessus de zones conductrices correspondantes formées sur la surface de la section adjacente correspondante de la plaquette de circuit imprimé. Les conducteurs du boîtier sont connectés chacun aux zones de la plaquette de circuit imprimé, à l'aide d'un ou de plusieurs fils de connexion souples. Outre le fait de connecter électriquement les conducteurs du boîtier aux sections correspondantes de la plaquette de circuit imprimé, les fils de connexion fixent collectivement le boîtier sur le dissipateur de chaleur, de manière à permettre un déplacement relatif latéral entre la bride et les surfaces du dissipateur, en réponse à des stress thermiques.

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