Wire bond pad and method therefor

Details Wire bond pad and method therefor Wire bond pad and method therefor

H - Electricity

01

R

H01R 4/58 (2006.01) H01L 23/498 (2006.01) H01R 12/00 (2006.01)

Patent

CA 2332209

A wire bond pad in an electrical circuit device package and method therefor including forming an opening in a conductor of a first electrically conductive material, forming a conducting member of a second electrically conductive material, transferring the conducting member into the opening of the conductor, electrically contacting the conducting member with the conductor, and embedding conductor with the conducting member in the opening thereof in an insulating electrical circuit device package.

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